Products
Product Introduction
LED
Industrial Control
? ? ? ? We invest a lot of resources in technology research and development, especially in medical devices, automotive electronics, testing and control systems, instrumentation, etc., where the accuracy and stability of products are extremely high. With its advanced automated production lines and precision inspection equipment, we are able to ensure the high-quality output of our products and meet the needs of the industrial control industry for highly reliable components.
Computer
? ? ? ? We not only specialize in the design and manufacture of printed circuit boards (PCBS), but also provide comprehensive solutions in a number of related fields, including but not limited to computer motherboards, laptops, servers and other computer-related accessories. We continue to develop technologies and innovate products, especially in high-speed signal processing, thermal management and EMI/RFI shielding. These technological advances directly improve the performance and stability of the computer motherboard and other key components, helping to improve the overall operating efficiency of the system.
Server
? ? ? ? 我們擅長制造高精度、高密度的雙面及多層PCB，這是服務(wù)器主板及其他關(guān)鍵組件的核心。這些PCB在服務(wù)器中起著至關(guān)重要的作用，因?yàn)樗鼈兂休d著大量的電子元件，如處理器、內(nèi)存模塊、電源管理單元等。我們的PCB能夠確保服務(wù)器內(nèi)部各個(gè)組件之間信號(hào)傳輸?shù)臏?zhǔn)確性和穩(wěn)定性，進(jìn)而保障服務(wù)器的整體性能。
Communication
We specialize in the manufacture of high-precision, high-density double-sided and multi-layer printed circuit board PCBS, which are an integral part of communication equipment. These PCBS carry a large number of electronic components, such as processors, RF modules, antenna interfaces, etc., which are critical to the performance of communication devices. Our PCBS ensure the accuracy and stability of signal transmission between the various components within the communication equipment, thus guaranteeing the overall performance of the communication equipment.
Automotive
? ? ? ? We specialize in manufacturing high-precision, high-density double-sided and multilayer printed circuit PCBS, which are essential for automotive electronic systems. These PCBS carry various electronic components in the car, such as sensors, controllers, in-car entertainment systems, etc. Our PCBS ensure the accuracy and stability of signal transmission between the various components within the automotive electronic system, thereby guaranteeing the safety and driving experience of the vehicle.
Medical
? ? ? ? We are able to provide customized PCB design and manufacturing services according to the specific needs of our customers. There are many kinds of medical equipment, including diagnostic equipment, monitoring equipment, treatment equipment, etc., and each equipment has different requirements for PCB. Our team of professionals can understand these needs and provide tailored solutions to ensure stable operation of medical devices in a variety of complex environments.
Other
? ? ? ? We continue to develop technology, especially in high-speed signal processing, RF signal processing, thermal design, electromagnetic compatibility (EMC) and other areas have made significant progress. Advances in these technologies are critical to a number of high-tech areas, including mobile phones, wearables, iot devices, and other electronics.
Product Application
| 展品編號(hào)(Exhibit number): | JSY-007 |
| 產(chǎn)品應(yīng)用(Exhibit number): | LED lamp panel |
| 產(chǎn)品結(jié)構(gòu)(Product mix): | 4 layers 1 order - point spacing P1.25 |
| 產(chǎn)品厚度(Product thickness): | 1.6mm |
| 線寬線距(Line width Line distance): | 3.5/3.5mi |
| 最小孔徑(Min Hole Diameter): | Laser perforation 0.1mm |
| 表面處理(Surface treatment): | oxidation resistance |
| 工藝特點(diǎn)(Technological characteristics): | The number of lamp PAD is 129600; The distance between cable and PAD is 3.5mil |
| 鉆孔結(jié)構(gòu)(Borehole structure): | 1-2/2-3/3-4 floor |
Serial number: JSY-007
| 展品編號(hào)(Exhibit number): | JSY-010 |
| 產(chǎn)品應(yīng)用(Exhibit number): | graphics card |
| 產(chǎn)品結(jié)構(gòu)(Product mix): | 4 layers through holes |
| 產(chǎn)品厚度(Product thickness): | 1.2mm |
| 線寬線距(Line width Line distance): | 4/4mil |
| 最小孔徑(Min Hole Diameter): | Through hole 0.2mm |
| 表面處理(Surface treatment): | Antioxidant + gold-plated finger 3U |
| 工藝特點(diǎn)(Technological characteristics): | Gold-plated finger |
| 鉆孔結(jié)構(gòu)(Borehole structure): | 1-4 floor |
Number: JSY-010
| 展品編號(hào)(Exhibit number): | JSY-013 |
| 產(chǎn)品應(yīng)用(Exhibit number): | graphics card |
| 產(chǎn)品結(jié)構(gòu)(Product mix): | 6 layers through holes |
| 產(chǎn)品厚度(Product thickness): | 1.6mm |
| 線寬線距(Line width Line distance): | 3.5/3.5mil |
| 最小孔徑(Min Hole Diameter): | Through hole 0.2mm |
| 表面處理(Surface treatment): | Antioxidant + gold-plated finger 10U |
| 工藝特點(diǎn)(Technological characteristics): | Gold plated finger 10U |
| 鉆孔結(jié)構(gòu)(Borehole structure): | 1-6 floor |
Number: JSY-013
| 展品編號(hào)(Exhibit number): | JSY-007 |
| 產(chǎn)品應(yīng)用(Exhibit number): | mainboard |
| 產(chǎn)品結(jié)構(gòu)(Product mix): | 4 layers through holes |
| 產(chǎn)品厚度(Product thickness): | 1.2mm |
| 線寬線距(Line width Line distance): | 4/4mil |
| 最小孔徑(Min Hole Diameter): | Through hole 0.2mm |
| 表面處理(Surface treatment): | Antioxidant + gold-plated finger 3U |
| 工藝特點(diǎn)(Technological characteristics): | Gold-plated finger |
| 鉆孔結(jié)構(gòu)(Borehole structure): | 1-4 floor |
Serial number: JSY-007
| 展品編號(hào)(Exhibit number): | JSY-014 |
| 產(chǎn)品應(yīng)用(Exhibit number): | mainboard |
| 產(chǎn)品結(jié)構(gòu)(Product mix): | 12 layers through holes |
| 產(chǎn)品厚度(Product thickness): | 1.6mm |
| 線寬線距(Line width Line distance): | 3/3mil |
| 最小孔徑(Min Hole Diameter): | Through hole 0.2mm |
| 表面處理(Surface treatment): | Gold Plating |
| 工藝特點(diǎn)(Technological characteristics): | BGA size 0.15*0.25mm double cpu |
| 鉆孔結(jié)構(gòu)(Borehole structure): | 1-12 floor |
Number: JSY-014
| 展品編號(hào)(Exhibit number): | JSY-020 |
| 產(chǎn)品應(yīng)用(Exhibit number): | Server |
| 產(chǎn)品結(jié)構(gòu)(Product mix): | 14層通孔 |
| 產(chǎn)品厚度(Product thickness): | 2.0mm |
| 線寬線距(Line width Line distance): | 4/4mil |
| 最小孔徑(Min Hole Diameter): | Through hole 0.2mm |
| 表面處理(Surface treatment): | oxidation resistance |
| 工藝特點(diǎn)(Technological characteristics): | 高速板、3個(gè)背鉆、 10:1厚徑比 |
| 鉆孔結(jié)構(gòu)(Borehole structure): | 1-14層 |
編號(hào)：JSY-020
| 展品編號(hào)(Exhibit number): | JSY-021 |
| 產(chǎn)品應(yīng)用(Exhibit number): | Server |
| 產(chǎn)品結(jié)構(gòu)(Product mix): | 12 layers through holes |
| 產(chǎn)品厚度(Product thickness): | 2.3mm |
| 線寬線距(Line width Line distance): | 4/4mil |
| 最小孔徑(Min Hole Diameter): | 通孔0.25mm |
| 表面處理(Surface treatment): | oxidation resistance |
| 工藝特點(diǎn)(Technological characteristics): | 9:1厚徑比 |
| 鉆孔結(jié)構(gòu)(Borehole structure): | 1-12 floor |
編號(hào)：JSY-018
| 展品編號(hào)(Exhibit number): | JSY-007 |
| 產(chǎn)品應(yīng)用(Exhibit number): | interphone |
| 產(chǎn)品結(jié)構(gòu)(Product mix): | 8 floors -2 floors |
| 產(chǎn)品厚度(Product thickness): | 1.6mm |
| 線寬線距(Line width Line distance): | 4/4mil， Laser perforation 0.1mm |
| 最小孔徑(Min Hole Diameter): | Through hole 0.2mm |
| 表面處理(Surface treatment): | Gold Plating |
| 工藝特點(diǎn)(Technological characteristics): | 5 BGA, pressed 3 times; Two fillings, two lasers; Through hole resin jack |
| 鉆孔結(jié)構(gòu)(Borehole structure): | 1-2/2-3/1-3/3-6/ 6-7/7-8/6-8/1-8 floor |
Serial number: JSY-007
| 展品編號(hào)(Exhibit number): | JSY-011 |
| 產(chǎn)品應(yīng)用(Exhibit number): | Headphone board |
| 產(chǎn)品結(jié)構(gòu)(Product mix): | 6 floors, 1 level |
| 產(chǎn)品厚度(Product thickness): | 0.8mm |
| 線寬線距(Line width Line distance): | 4/4mil |
| 最小孔徑(Min Hole Diameter): | Through hole 0.15mm; Laser perforation 0.1mm |
| 表面處理(Surface treatment): | Gold Plating |
| 工藝特點(diǎn)(Technological characteristics): | Metal edge |
| 鉆孔結(jié)構(gòu)(Borehole structure): | 1-2/2-5/5-6層 |
編號(hào)：JSY-011
| 展品編號(hào)(Exhibit number): | JSY-018 |
| 產(chǎn)品應(yīng)用(Exhibit number): | 汽車板 |
| 產(chǎn)品結(jié)構(gòu)(Product mix): | 雙面 |
| 產(chǎn)品厚度(Product thickness): | 1.0mm |
| 線寬線距(Line width Line distance): | 1.0/1.0mm |
| 最小孔徑(Min Hole Diameter): | 通孔0.3mm |
| 表面處理(Surface treatment): | Gold Plating |
| 工藝特點(diǎn)(Technological characteristics): | CTI≥600，1.5/1.5OZ |
| 鉆孔結(jié)構(gòu)(Borehole structure): | 1-2層 |
編號(hào)：JSY-018
| 展品編號(hào)(Exhibit number): | JSY-019 |
| 產(chǎn)品應(yīng)用(Exhibit number): | 汽車板 |
| 產(chǎn)品結(jié)構(gòu)(Product mix): | 雙面 |
| 產(chǎn)品厚度(Product thickness): | 1.6mm |
| 線寬線距(Line width Line distance): | 0.2/0.2mm |
| 最小孔徑(Min Hole Diameter): | 通孔0.3mm |
| 表面處理(Surface treatment): | 沉金1.5U |
| 工藝特點(diǎn)(Technological characteristics): | CTI≥600，1.5/1.5OZ |
| 鉆孔結(jié)構(gòu)(Borehole structure): | 1-2層 |
編號(hào)：JSY-019
| 展品編號(hào)(Exhibit number): | JSY-002 |
| 產(chǎn)品應(yīng)用(Exhibit number): | Android motherboard |
| 產(chǎn)品結(jié)構(gòu)(Product mix): | 8 floors -2 floors |
| 產(chǎn)品厚度(Product thickness): | 1.6mm |
| 線寬線距(Line width Line distance): | 3.5/3mil |
| 最小孔徑(Min Hole Diameter): | Through hole 0.25mm; Laser perforation 0.1mm |
| 表面處理(Surface treatment): | Gold Plating |
| 工藝特點(diǎn)(Technological characteristics): | Five BGA, pressed three times, Two fillings, two lasers |
| 鉆孔結(jié)構(gòu)(Borehole structure): | 1-2/2-3/1-3/3-6/ 6-7/7-8/6-8/1-8 floor |
Serial number：JSY-002
| 展品編號(hào)(Exhibit number): | JSY-007 |
| 產(chǎn)品應(yīng)用(Exhibit number): | interphone |
| 產(chǎn)品結(jié)構(gòu)(Product mix): | 8 floors -2 floors |
| 產(chǎn)品厚度(Product thickness): | 1.6mm |
| 線寬線距(Line width Line distance): | 4/4mil， Laser perforation 0.1mm |
| 最小孔徑(Min Hole Diameter): | Through hole 0.2mm |
| 表面處理(Surface treatment): | Gold Plating |
| 工藝特點(diǎn)(Technological characteristics): | 5 BGA, pressed 3 times; Two fillings, two lasers; Through hole resin jack |
| 鉆孔結(jié)構(gòu)(Borehole structure): | 1-2/2-3/1-3/3-6/ 6-7/7-8/6-8/1-8 floor |
Serial number: JSY-006
Quality Control
Production Phase
? ? In today's fast-paced business environment, Jinshiyu Electronics Co., Ltd. knows that time is money. Therefore, the company is always committed to providing customers with punctual and flexible delivery services and professional and rapid response capabilities.
